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dc.contributor.authorZhao, Jie
dc.contributor.authorWei, Xuecheng
dc.contributor.authorLiang, Dongdong
dc.contributor.authorHu, Qiang
dc.contributor.authorYan, Jianchang
dc.contributor.authorWang, Junxi
dc.contributor.authorWei, Tongbo
dc.date.accessioned2022-02-04T14:34:00Z
dc.date.available2022-02-04T14:34:00Z
dc.date.copyright2020/04/17/
dc.date.issued2020
dc.identifier.issn1043-7398
dc.identifier.otherep_142_03_031104.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4273924
dc.description.abstractWe fabricated the dual-wavelength InxGa1−xN/GaN nanorods for wide-spectrum light-emitting diodes (LEDs) by silica nanosphere lithography (SNL) technique. The emission properties of the dual-wavelength nanorods are characterized by micro-photoluminescence (micro-PL), cathodoluminescence (CL), and temperature-dependent PL (TDPL) measurements. Nanorod structure can effectively suppress quantum confined Stark effect (QCSE) compared with planar structure due to the strain relaxation. In addition, the internal quantum efficiency (IQE) of the green quantum well (QW) within nanorod structure increases, but the IQE of the blue QW clearly decreases because blue QW has severely suffered from the nonradiative recombination by surface damage. Furthermore, the IQEs of the green QW and the blue QW within the nanorod structure can be effectively improved by wet etching treatment, with an increase in factor by 1.3 when compared with unetched nanorod structure. Evidently, the dual-wavelength InxGa1−xN/GaN nanorods are beneficial to improve the optical performance compared with planar structure, presenting a potential to realize monolithic, high-efficiency, and cost-effective white LEDs.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleThe Optical Properties of Dual-Wavelength InxGa1−xN/GaN Nanorods for Wide-Spectrum Light-Emitting Diodes
dc.typeJournal Paper
dc.journal.volume142
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4046766
dc.page31104
dc.treeJournal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003
dc.contenttypeFulltext


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