| dc.contributor.author | Wang, Yuejin | |
| dc.contributor.author | Liu, Guozhen | |
| dc.contributor.author | Lu, Shiqiang | |
| dc.contributor.author | Guo, Bin | |
| dc.contributor.author | Zhang, Hongye | |
| dc.contributor.author | Xu, Fuchun | |
| dc.contributor.author | Chen, Xiaohong | |
| dc.contributor.author | Cai, Duanjun | |
| dc.contributor.author | Kang, Junyong | |
| dc.date.accessioned | 2022-02-04T14:33:52Z | |
| dc.date.available | 2022-02-04T14:33:52Z | |
| dc.date.copyright | 2020/04/17/ | |
| dc.date.issued | 2020 | |
| dc.identifier.issn | 1043-7398 | |
| dc.identifier.other | ep_142_03_031103.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4273921 | |
| dc.description.abstract | Hexagonal boron nitride (h-BN) is the most well-known wide band gap two-dimensional (2D) material (> 6 eV). To achieve its applications in optoelectronic devices, the conductance of h-BN must be implemented to the extent that it can be fabricated into a p–n junction. Here, we demonstrate a method to improve the surface current of p-type h-BN monolayer by introducing additional nitrogen gas flow during growth. First-principles calculations were conducted to show that nitrogen atmosphere can promote the formation of boron vacancy, making a low barrier site for Mg doping incorporation. Magnesium-doped h-BN monolayer was achieved using a low pressure chemical vapor deposition method under N2 flux. The surface current has been enhanced by three times up to 16 μA under 4 V external voltage. This approach provides potential applications of controllable conductive h-BN film for two-dimensional optoelectronic devices. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Surface Current Improvement of Magnesium-Doped Hexagonal Boron Nitride Monolayer by Additional Nitrogen Gas Flow | |
| dc.type | Journal Paper | |
| dc.journal.volume | 142 | |
| dc.journal.issue | 3 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4046765 | |
| dc.page | 31103 | |
| dc.tree | Journal of Electronic Packaging:;2020:;volume( 142 ):;issue: 003 | |
| dc.contenttype | Fulltext | |