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Special Issue on InterPACK 2018

dc.contributor.authorDede, Ercan M.
dc.contributor.authorBoteler, Lauren
dc.contributor.authorChen, Changqing
dc.contributor.authorGromala, Przemyslaw Jakub
dc.contributor.authorLeever, Benjamin
dc.contributor.authorLi, Wei
dc.date.accessioned2019-09-18T09:08:10Z
dc.date.available2019-09-18T09:08:10Z
dc.date.copyright5/8/2019 12:00:00 AM
dc.date.issued2019
dc.identifier.issn1043-7398
dc.identifier.otherep_141_03_030301
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4259272
dc.publisherAmerican Society of Mechanical Engineers (ASME)
dc.titleSpecial Issue on InterPACK 2018
dc.typeJournal Paper
dc.journal.volume141
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4043484
dc.journal.fristpage30301
dc.journal.lastpage030301-1
dc.treeJournal of Electronic Packaging:;2019:;volume( 141 ):;issue: 003
dc.contenttypeFulltext


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