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Special Section of Review Articles From Intel Corporation

dc.contributor.authorYang, Jin
dc.date.accessioned2019-09-18T09:04:02Z
dc.date.available2019-09-18T09:04:02Z
dc.date.copyright3/6/2019 12:00:00 AM
dc.date.issued2019
dc.identifier.issn1043-7398
dc.identifier.otherep_141_01_010301.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4258462
dc.publisherAmerican Society of Mechanical Engineers (ASME)
dc.titleSpecial Section of Review Articles From Intel Corporation
dc.typeJournal Paper
dc.journal.volume141
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4042803
dc.journal.fristpage10301
dc.journal.lastpage010301-1
dc.treeJournal of Electronic Packaging:;2019:;volume( 141 ):;issue: 001
dc.contenttypeFulltext


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