Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques

dc.contributor.author	Sesek, Aleksander
dc.contributor.author	Chambers, Olga
dc.contributor.author	Trontelj, Janez
dc.date.accessioned	2019-09-18T09:04:01Z
dc.date.available	2019-09-18T09:04:01Z
dc.date.copyright	3/4/2019 12:00:00 AM
dc.date.issued	2019
dc.identifier.issn	1043-7398
dc.identifier.other	ep_141_02_021005.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl1/handle/yetl/4258458
dc.description.abstract	Power electronic components' reliability depends, to a great extent, on the quality of die-attach technology. The voids appearance in the die-attach regions is almost unavoidable during the manufacturing process. The aim of this paper is to demonstrate that image processing tools enable fast and accurate void segmentation, while reducing manual interaction for X-ray monitoring of imperfect power transistor die soldering. The most common void parameters such as void area, void distribution, and shape roundness were extracted and used for statistical analysis.
dc.publisher	American Society of Mechanical Engineers (ASME)
dc.title	Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
dc.type	Journal Paper
dc.journal.volume	141
dc.journal.issue	2
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.4042804
dc.journal.fristpage	21005
dc.journal.lastpage	021005-7
dc.tree	Journal of Electronic Packaging:;2019:;volume( 141 ):;issue: 002
dc.contenttype	Fulltext