| dc.contributor.author | Wu, Bo | |
| dc.contributor.author | Zhang, Shuanghai | |
| dc.contributor.author | Wang, Fuliang | |
| dc.contributor.author | Chen, Zhuo | |
| dc.date.accessioned | 2019-02-28T11:14:25Z | |
| dc.date.available | 2019-02-28T11:14:25Z | |
| dc.date.copyright | 8/6/2018 12:00:00 AM | |
| dc.date.issued | 2018 | |
| dc.identifier.issn | 1043-7398 | |
| dc.identifier.other | ep_140_04_044502.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl1/handle/yetl/4254182 | |
| dc.description.abstract | The incorporation of a micro copper pillar is considered as the major interconnection method in three-dimensional (3D) integrated circuit (IC) intergradation under high-density I/O conditions. To achieve low-temperature bonding, this study investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 μm pillar bump, and substrate temperature of 200 °C. Additionally, the effect of the bonding force on bonding interface microstructure and intermetallic compounds (IMCs) was also investigated. Tin whiskers were also observed at the bonding interface at low bonding forces. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding | |
| dc.type | Journal Paper | |
| dc.journal.volume | 140 | |
| dc.journal.issue | 4 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4040794 | |
| dc.journal.fristpage | 44502 | |
| dc.journal.lastpage | 044502-5 | |
| dc.tree | Journal of Electronic Packaging:;2018:;volume( 140 ):;issue: 004 | |
| dc.contenttype | Fulltext | |
