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Special Section on InterPACK 2017—Part 2

dc.contributor.authorMysore, Kaushik
dc.contributor.authorNarumanchi, Sreekant
dc.contributor.authorDede, Ercan
dc.contributor.authorKhiabani, Reza
dc.date.accessioned2019-02-28T11:14:18Z
dc.date.available2019-02-28T11:14:18Z
dc.date.copyright5/9/2018 12:00:00 AM
dc.date.issued2018
dc.identifier.issn1043-7398
dc.identifier.otherep_140_02_020301.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4254168
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleSpecial Section on InterPACK 2017—Part 2
dc.typeJournal Paper
dc.journal.volume140
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4039963
dc.journal.fristpage20301
dc.journal.lastpage020301-1
dc.treeJournal of Electronic Packaging:;2018:;volume( 140 ):;issue: 002
dc.contenttypeFulltext


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