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dc.contributor.authorAlkharabsheh, Sami
dc.contributor.authorPuvvadi, Udaya L. N.
dc.contributor.authorRamakrishnan, Bharath
dc.contributor.authorGhose, Kanad
dc.contributor.authorSammakia, Bahgat
dc.date.accessioned2019-02-28T11:14:08Z
dc.date.available2019-02-28T11:14:08Z
dc.date.copyright5/9/2018 12:00:00 AM
dc.date.issued2018
dc.identifier.issn1043-7398
dc.identifier.otherep_140_02_020902.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl1/handle/yetl/4254138
dc.description.abstractIn this paper, the impact of direct liquid cooling (DLC) system failure on the information technology (IT) equipment is studied experimentally. The main factors that are anticipated to affect the IT equipment response during failure are the central processing unit (CPU) utilization, coolant set point temperature (SPT), and the server type. These factors are varied experimentally and the IT equipment response is studied in terms of chip temperature and power, CPU utilization, and total server power. It was found that failure of this cooling system is hazardous and can lead to data center shutdown in less than a minute. Additionally, the CPU frequency throttling mechanism was found to be vital to understand the change in chip temperature, power, and utilization. Other mechanisms associated with high temperatures were also observed such as the leakage power and the fans' speed change. Finally, possible remedies are proposed to reduce the probability and the consequences of the cooling system failure.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleFailure Analysis of Direct Liquid Cooling System in Data Centers
dc.typeJournal Paper
dc.journal.volume140
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4039137
dc.journal.fristpage20902
dc.journal.lastpage020902-8
dc.treeJournal of Electronic Packaging:;2018:;volume( 140 ):;issue: 002
dc.contenttypeFulltext


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