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dc.contributor.authorYou
dc.contributor.authorXiangyu;Ye
dc.contributor.authorChengcong;Guo
dc.contributor.authorPing
dc.date.accessioned2017-12-30T11:43:33Z
dc.date.available2017-12-30T11:43:33Z
dc.date.copyright9/27/2017 12:00:00 AM
dc.date.issued2017
dc.identifier.issn2166-0468
dc.identifier.otherjmnm_005_04_040901.pdf
dc.identifier.urihttp://138.201.223.254:8080/yetl1/handle/yetl/4242837
dc.description.abstractThree-dimensional (3D) printing of microscale structures with high-resolution (submicron) and low-cost is still a challenging work for the existing 3D printing techniques. Here, we report a direct writing process via near-field melt electrospinning (NFME) to achieve microscale printing of single filament wall structures. The process allows continuous direct writing due to the linear and stable jet trajectory in the electric near field. The layer-by-layer stacking of fibers, or self-assembly effect, is attributed to the attraction force from the molten deposited fibers and accumulated negative charges. We demonstrated successful printing of various 3D thin-wall structures with a minimal wall thickness less than 5 μm. By optimizing the process parameters of NFME, ultrafine poly (ε-caprolactone) (PCL) fibers have been stably generated and precisely stacked and fused into 3D thin-wall structures with an aspect ratio of more than 60. It is envisioned that the NFME can be transformed into a viable high-resolution and low-cost microscale 3D printing technology.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleStudy of Microscale Three-Dimensional Printing Using Near-Field Melt Electrospinning
dc.typeJournal Paper
dc.journal.volume5
dc.journal.issue4
dc.journal.titleJournal of Micro and Nano-Manufacturing
dc.identifier.doi10.1115/1.4037788
dc.journal.fristpage40901
dc.journal.lastpage040901-5
dc.treeJournal of Micro and Nano-Manufacturing:;2017:;volume( 005 ):;issue: 004
dc.contenttypeFulltext


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