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dc.contributor.authorMcCann, Scott
dc.contributor.authorOstrowicki, Gregory T.
dc.contributor.authorTran, Anh
dc.contributor.authorHuang, Timothy
dc.contributor.authorBernhard, Tobias
dc.contributor.authorTummala, Rao R.
dc.contributor.authorSitaraman, Suresh K.
dc.date.accessioned2017-11-25T07:21:05Z
dc.date.available2017-11-25T07:21:05Z
dc.date.copyright2017/25/8
dc.date.issued2017
dc.identifier.issn1043-7398
dc.identifier.otherep_139_04_041003.pdf
dc.identifier.urihttp://138.201.223.254:8080/yetl1/handle/yetl/4236874
dc.description.abstractA method to determine the critical energy release rate of a peel tested sample using an energy-based approach within a finite element framework is developed. The method uses a single finite element model, in which the external work, elastic strain energy, and inelastic strain energy are calculated as nodes along the crack interface are sequentially decoupled. The energy release rate is calculated from the conservation of energy. By using a direct, energy-based approach, the method can account for large plastic strains and unloading, both of which are common in peel tests. The energy rates are found to be mesh dependent; mesh and convergence strategies are developed to determine the critical energy release rate. An example of the model is given in which the critical energy release rate of a 10-μm thick electroplated copper thin film bonded to a borosilicate glass substrate which exhibited a 3.0 N/cm average peel force was determined to be 20.9 J/m2.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDetermination of Energy Release Rate Through Sequential Crack Extension
dc.typeJournal Paper
dc.journal.volume139
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4037334
dc.journal.fristpage41003
dc.journal.lastpage041003-9
dc.treeJournal of Electronic Packaging:;2017:;volume( 139 ):;issue: 004
dc.contenttypeFulltext


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