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dc.contributor.authorFalsetti, C.
dc.contributor.authorMagnini, M.
dc.contributor.authorThome, J. R.
dc.date.accessioned2017-11-25T07:21:04Z
dc.date.available2017-11-25T07:21:04Z
dc.date.copyright2017/10/7
dc.date.issued2017
dc.identifier.issn1043-7398
dc.identifier.otherep_139_03_031008.pdf
dc.identifier.urihttp://138.201.223.254:8080/yetl1/handle/yetl/4236869
dc.description.abstractThe development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. In this framework, two-phase cooling is a promising solution for dissipating the greater amount of generated heat. In the present study, an experimental investigation of two-phase flow boiling in a micro-pin fin evaporator is performed. The micro-evaporator has a heated area of 1 cm2 containing 66 rows of cylindrical in-line micro-pin fins with diameter, height, and pitch of, respectively, 50 μm, 100 μm, and 91.7 μm. The working fluid is R1234ze(E) tested over a wide range of conditions: mass fluxes varying from 750 kg/m2 s to 1750 kg/m2 s and heat fluxes ranging from 20 W/cm2 to 44 W/cm2. The effects of saturation temperature on the heat transfer are investigated by testing three different outlet saturation temperatures: 25 °C, 30 °C, and 35 °C. In order to assess the thermal–hydraulic performance of the current heat sink, the total pressure drops are directly measured, while local values of heat transfer coefficient are evaluated by coupling high-speed flow visualization with infrared temperature measurements. According to the experimental results, the mass flux has the most significant impact on the heat transfer coefficient while heat flux is a less influential parameter. The vapor quality varies in a range between 0 and 0.45. The heat transfer coefficient in the subcooled region reaches a maximum value of about 12 kW/m2 K, whilst in two-phase flow it goes up to 30 kW/m2 K.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleFlow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator
dc.typeJournal Paper
dc.journal.volume139
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4037152
dc.journal.fristpage31008
dc.journal.lastpage031008-8
dc.treeJournal of Electronic Packaging:;2017:;volume( 139 ):;issue: 003
dc.contenttypeFulltext


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