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dc.contributor.authorde Oliveira, Pablo A.
dc.contributor.authorBarbosa, , Jr., Jader R.
dc.date.accessioned2017-11-25T07:21:04Z
dc.date.available2017-11-25T07:21:04Z
dc.date.copyright2017/28/6
dc.date.issued2017
dc.identifier.issn1043-7398
dc.identifier.otherep_139_03_031005.pdf
dc.identifier.urihttp://138.201.223.254:8080/yetl1/handle/yetl/4236866
dc.description.abstractThe performance of a novel impinging two-phase jet heat sink operating with single and multiple jets is presented and the influence of the following parameters is quantified: (i) thermal load applied on the heat sink and (ii) geometrical arrangement of the orifices (jets). The heat sink is part of a vapor compression cooling system equipped with an R-134a small-scale oil-free linear motor compressor. The evaporator and the expansion device are integrated into a single cooling unit. The expansion device can be a single orifice or an array of orifices responsible for the generation of two-phase jet(s) impinging on a surface where a concentrated heat load is applied. The analysis is based on the thermodynamic performance and steady-state heat transfer parameters associated with the impinging jet(s) for single and multiple orifice tests. The two-phase jet heat sink was capable of dissipating cooling loads of up to 160 W and 200 W from a 6.36 cm2 surface for single and multiple orifice configurations, respectively. For these cases, the temperature of the impingement surface was kept below 40 °C and the average heat transfer coefficient reached values between 14,000 and 16,000 W/(m2 K).
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titlePerformance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
dc.typeJournal Paper
dc.journal.volume139
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4036817
dc.journal.fristpage31005
dc.journal.lastpage031005-11
dc.treeJournal of Electronic Packaging:;2017:;volume( 139 ):;issue: 003
dc.contenttypeFulltext


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