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Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

dc.contributor.authorBrunschwiler, Thomas
dc.contributor.authorZürcher, Jonas
dc.contributor.authorDel Carro, Luca
dc.contributor.authorSchlottig, Gerd
dc.contributor.authorBurg, Brian
dc.contributor.authorZimmermann, Severin
dc.contributor.authorZschenderlein, Uwe
dc.contributor.authorWunderle, Bernhard
dc.contributor.authorSchindler-Saefkow, Florian
dc.contributor.authorStässle, Rahel
dc.date.accessioned2017-11-25T07:21:02Z
dc.date.available2017-11-25T07:21:02Z
dc.date.copyright2017/19/1
dc.date.issued2017
dc.identifier.issn1043-7398
dc.identifier.otherep_139_01_017001.pdf
dc.identifier.urihttp://138.201.223.254:8080/yetl1/handle/yetl/4236843
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleErratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]
dc.typeJournal Paper
dc.journal.volume139
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4035707
dc.journal.fristpage17001
dc.journal.lastpage017001-1
dc.treeJournal of Electronic Packaging:;2017:;volume( 139 ):;issue: 001
dc.contenttypeFulltext


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