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dc.contributor.authorHsu, Shou-Jen
dc.contributor.authorLee, Chin C.
dc.date.accessioned2017-11-25T07:21:00Z
dc.date.available2017-11-25T07:21:00Z
dc.date.copyright2016/10/10
dc.date.issued2016
dc.identifier.issn1043-7398
dc.identifier.otherep_138_04_041006.pdf
dc.identifier.urihttp://138.201.223.254:8080/yetl1/handle/yetl/4236825
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleGrowth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
dc.typeJournal Paper
dc.journal.volume138
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4034842
dc.journal.fristpage41006
dc.journal.lastpage041006-5
dc.treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 004
dc.contenttypeFulltext


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