Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples
| dc.contributor.author | Hsu, Shou-Jen | |
| dc.contributor.author | Lee, Chin C. | |
| dc.date.accessioned | 2017-11-25T07:21:00Z | |
| dc.date.available | 2017-11-25T07:21:00Z | |
| dc.date.copyright | 2016/10/10 | |
| dc.date.issued | 2016 | |
| dc.identifier.issn | 1043-7398 | |
| dc.identifier.other | ep_138_04_041006.pdf | |
| dc.identifier.uri | http://138.201.223.254:8080/yetl1/handle/yetl/4236825 | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Growth Kinetics of Intermetallic Compounds Between Sn and Fe Liquid–Solid Reaction Couples | |
| dc.type | Journal Paper | |
| dc.journal.volume | 138 | |
| dc.journal.issue | 4 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4034842 | |
| dc.journal.fristpage | 41006 | |
| dc.journal.lastpage | 041006-5 | |
| dc.tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 004 | |
| dc.contenttype | Fulltext |