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dc.contributor.authorKhanikar, Prasenjit
dc.contributor.authorWu, Qifeng
dc.contributor.authorZikry, M. A.
dc.date.accessioned2017-05-09T01:29:08Z
dc.date.available2017-05-09T01:29:08Z
dc.date.issued2016
dc.identifier.issn0094-4289
dc.identifier.othermats_138_03_031009.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/161263
dc.description.abstractA dislocation densitybased crystal plasticity framework, a nonlinear computational finiteelement methodology adapted for nucleation of crack on cleavage planes, and rational crystallographic orientation relations were used to predict the failure modes associated with the high strain rate behavior of aluminumbonded composites. A bonded aluminum composite, suitable for high strainrate damage resistance application, was modeled with different microstructures representing precipitates, dispersed particles, and grain boundary (GB) distributions. The dynamic fracture approach is used to investigate crack nucleation and growth as a function of the different microstructural characteristics of each alloy in bonded composites with and without preexisting cracks. The nonplanar and irregular nature of the crack paths were mainly due to the microstructural features, such as precipitates and dispersed particles distributions and orientations, ahead of the crack front. The evolution of dislocation density and the subsequent formation of localized plastic slip contributed to the blunting of the propagating crack(s). Extensive geometrical and thermal softening resulted in localized plastic slip and had a significant effect on crack path orientations and directions along cleavage planes.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDynamic Fracture of Aluminum Bonded Composites
dc.typeJournal Paper
dc.journal.volume138
dc.journal.issue3
dc.journal.titleJournal of Engineering Materials and Technology
dc.identifier.doi10.1115/1.4033036
dc.journal.fristpage31009
dc.journal.lastpage31009
dc.identifier.eissn1528-8889
dc.treeJournal of Engineering Materials and Technology:;2016:;volume( 138 ):;issue: 003
dc.contenttypeFulltext


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