Recent Advances and New Trends in Flip Chip Technology

dc.contributor.author	Lau, John H.
dc.date.accessioned	2017-05-09T01:27:33Z
dc.date.available	2017-05-09T01:27:33Z
dc.date.issued	2016
dc.identifier.issn	1528-9044
dc.identifier.other	ep_138_03_030802.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/160829
dc.description.abstract	Recent advances in flip chip technology such as wafer bumping, package substrate, flip chip assembly, and underfill will be presented in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Recent Advances and New Trends in Flip Chip Technology
dc.type	Journal Paper
dc.journal.volume	138
dc.journal.issue	3
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.4034037
dc.journal.fristpage	30802
dc.journal.lastpage	30802
dc.identifier.eissn	1043-7398
dc.tree	Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 003
dc.contenttype	Fulltext