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dc.contributor.authorAnsari, Danish
dc.contributor.authorKim, Kwang
dc.date.accessioned2017-05-09T01:27:32Z
dc.date.available2017-05-09T01:27:32Z
dc.date.issued2016
dc.identifier.issn1528-9044
dc.identifier.otherfe_138_11_111301.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/160826
dc.description.abstractThe performances of various transverseflow doublelayer microchannel heat sink configurations were evaluated compared to those of parallelflow heat sink configurations via conjugate heat transfer analysis. For the analysis, threedimensional Navier–Stokes and energy equations for steady incompressible laminar flow were solved using a finitevolume solver. Water with temperaturedependent thermophysical properties was used as a coolant. The thermal resistances were evaluated for various flow configurations of both crosschannel and parallelchannel designs with identical geometric parameters and total flow rate. Changes in the microchannel flow direction lead to remarkable changes in thermal resistance and temperature uniformity. A transverseflow configuration exhibited the best overall performance among the tested flow configurations in terms of the thermal resistance, temperature uniformity, and pressure drop.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDouble Layer Microchannel Heat Sinks With Transverse Flow Configurations
dc.typeJournal Paper
dc.journal.volume138
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4033558
dc.journal.fristpage31005
dc.journal.lastpage31005
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 003
dc.contenttypeFulltext


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