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dc.contributor.authorShang, Bofeng
dc.contributor.authorYu, Xingjian
dc.contributor.authorZheng, Huai
dc.contributor.authorXie, Bin
dc.contributor.authorChen, Qi
dc.contributor.authorLuo, Xiaobing
dc.date.accessioned2017-05-09T01:27:30Z
dc.date.available2017-05-09T01:27:30Z
dc.date.issued2016
dc.identifier.issn1528-9044
dc.identifier.othermed_010_02_020934.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/160817
dc.description.abstractThe phosphor diptransfer coating method is simple and flexible for transferring a preanalyzed volume of phosphor gel, which can be beneficial to the high angular color uniformity (ACU) of white lightemitting diodes (LEDs). The crux of this method is the volume control of the phosphor gel; however, the critical factors which influence the volume control remain unrevealed. In this paper, we concentrate on investigating the transferred volume in terms of three parameters: withdrawal speed, post radius, and dipping depth. Numerical simulations were carried out utilizing the volume of fluid (VOF) model combined with the dynamic mesh model. The experiments were also conducted on an optical platform equipped with a highspeed camera. The simulation results coincide well with the experimental results, with the maximum relative difference within 15%. The results show that the transferred volume increases with the increasing withdrawal speed and remains stable when the speed is greater than 1 mm/s, and it shows a linear relationship with the cube of post radius. And the transferred volume will increase with the dipping depth. Based on the experimental and numerically work, it is concluded that the volume of the preanalyzed phosphor gel can be precisely obtained.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleNumerical and Experimental Study on the Transferred Volume in Phosphor Dip Transfer Coating Process of Light Emitting Diodes Packaging
dc.typeJournal Paper
dc.journal.volume138
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4033165
dc.journal.fristpage21003
dc.journal.lastpage21003
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 002
dc.contenttypeFulltext


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