| dc.contributor.author | Siow, K. S. | |
| dc.contributor.author | Lin, Y. T. | |
| dc.date.accessioned | 2017-05-09T01:27:29Z | |
| dc.date.available | 2017-05-09T01:27:29Z | |
| dc.date.issued | 2016 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | mats_138_03_031005.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/160813 | |
| dc.description.abstract | Sintered silver joint is a porous silver that bonds a semiconductor die to the substrate as part of the packaging process. Sintered Ag is one of the few possible bonding methods to fulfill the operating conditions of wide bandgap (WBG) power device technologies. We review the current technology development of sintered Ag as a bonding material from the perspective of patents filed by various stakeholders since late 1980s. This review addresses the formulation of sintered pastes (i.e., nanoAg, hybrid Ag, and micron Ag fillers), innovations in the process and equipment to form this Ag joint. This review will provide the insights and confidence to engineers, scientists from universities and industry as well as investors who are developing and commercializing the sintered Ag as a bonding material for microelectronic packaging. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study | |
| dc.type | Journal Paper | |
| dc.journal.volume | 138 | |
| dc.journal.issue | 2 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4033069 | |
| dc.journal.fristpage | 20804 | |
| dc.journal.lastpage | 20804 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 002 | |
| dc.contenttype | Fulltext | |
