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dc.contributor.authorSaenen, Tom
dc.contributor.authorThome, John R.
dc.date.accessioned2017-05-09T01:27:25Z
dc.date.available2017-05-09T01:27:25Z
dc.date.issued2016
dc.identifier.issn1528-9044
dc.identifier.otherep_138_01_010901.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/160796
dc.description.abstractA fully dynamic model of a microchannel evaporator is presented. The aim of the model is to study the highly dynamic parallel channel instabilities that occur in these evaporators in more detail. The numerical solver for the model is custombuilt and the majority of the paper is focused on detailing the various aspects of this solver. The onedimensional homogeneous twophase flow conservation equations are solved to simulate the flow. The full threedimensional (3D) conduction domain of the evaporator is also dynamically resolved. This allows for the correct simulation of the complex hydraulic and thermal interactions between the microchannels that give rise to the parallel channel instabilities. The model uses stateoftheart correlations to calculate the frictional pressure losses and heat transfer in the microchannels. In addition, a model for inlet restrictions is also included to simulate the stabilizing effect of these components. In the final part of the paper, validation results of the model are presented, in which the stability results of the model are compared with the existing experimental data from the literature. Next, a parametric study is performed focusing on the stabilizing effects of the solid substrate properties. It is found that increasing the thermal conductivity and thickness of the solid substrate has a strong stabilizing effect, while increasing the number of microchannels has a small destabilizing effect. Finally, representative dynamic results are also given to demonstrate some of the unique capabilities of the model.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
dc.typeJournal Paper
dc.journal.volume138
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4032490
dc.journal.fristpage10901
dc.journal.lastpage10901
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001
dc.contenttypeFulltext


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