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dc.contributor.authorGallandat, Noris
dc.contributor.authorHesse, Danielle
dc.contributor.authorRhett Mayor, J.
dc.date.accessioned2017-05-09T01:27:24Z
dc.date.available2017-05-09T01:27:24Z
dc.date.issued2016
dc.identifier.issn1528-9044
dc.identifier.otherep_138_01_010908.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/160791
dc.description.abstractThe purpose of this paper is to demonstrate the possibility to selectively tune the convective heat transfer coefficient in different sections of a heat sink by varying the density of microfeatures in order to minimize temperature gradients between discrete heat sources positioned along the flow path. Lifetime of power electronics is strongly correlated to the thermal management of the junction. Therefore, it is of interest to have constant junction temperatures across all devices in the array. Implementation of microfeature enhancement on the convective side improves the heat transfer due to an increase in surface area. Specific shapes such as microhydrofoils offer a reduced pressure drop allowing for combined improvement of heat transfer and flow performance. This study presents experimental results from an array of three discrete heat sources (20 أ— 15 mm) generating 100 W/cm2 and positioned in line along the flow path with a spacing of 10 mm between each of the sources. The heat sink was machined out of aluminum 6061, and microhydrofoils with a characteristic length of 500 خ¼m were embedded in the cold plate. The cooling medium used is water at a flow rate of 3.6–13.4 g/s corresponding to a Reynolds number of 420–1575. It is demonstrated that the baseplate temperature can be maintained below 90 آ°C, and the difference between the maximum temperatures of each heat source is less than 6.7 آ°C at a heat flux of 100 W/cm2 and a water flow rate of 4.8 g/s.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleMicrofeature Heat Exchanger Using Variable Density Arrays for Near Isothermal Cold Plate Operation
dc.typeJournal Paper
dc.journal.volume138
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4032347
dc.journal.fristpage10908
dc.journal.lastpage10908
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2016:;volume( 138 ):;issue: 001
dc.contenttypeFulltext


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