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dc.contributor.authorAlkharabsheh, Sami
dc.contributor.authorFernandes, John
dc.contributor.authorGebrehiwot, Betsegaw
dc.contributor.authorAgonafer, Dereje
dc.contributor.authorGhose, Kanad
dc.contributor.authorOrtega, Alfonso
dc.contributor.authorJoshi, Yogendra
dc.contributor.authorSammakia, Bahgat
dc.date.accessioned2017-05-09T01:17:04Z
dc.date.available2017-05-09T01:17:04Z
dc.date.issued2015
dc.identifier.issn1528-9044
dc.identifier.otherep_137_04_040801.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/157708
dc.description.abstractData centers are mission critical facilities that typically contain thousands of data processing equipment, such as servers, switches, and routers. In recent years, there has been a boom in data center usage, leading their energy consumption to grow by about 10% a year continuously. The heat generated in these data centers must be removed so as to prevent high temperatures from degrading their reliability, which would cost additional energy. Therefore, precise and reliable thermal management of the data center environment is critical. This paper focuses on recent advancements in data center modeling and energy optimization. A number of currently available and developmental thermal management technology in data centers are broadly reviewed. Computational fluid dynamics (CFD) for raisedfloor data centers, experimental measurements, containment systems, economizer cooling, hybrid cooling, and device level cooling are all thoroughly reviewed. The paper concludes with a summary and presents areas of potential future research, which are based on the holistic integration of workload prediction and allocation, and thermal management using smart control systems.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleA Brief Overview of Recent Developments in Thermal Management in Data Centers
dc.typeJournal Paper
dc.journal.volume137
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4031326
dc.journal.fristpage40801
dc.journal.lastpage40801
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 004
dc.contenttypeFulltext


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