Double Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

Abstract

Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steadystate infrared (IR) microscopy experimental setup was designed and utilized to measure the crossplane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from 4 to 50 mm2 KW1. These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a hightemperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silverloaded thermal conductive adhesive (TCA).