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dc.contributor.authorTeshima, Hiromasa
dc.contributor.authorKojima, Kohei
dc.contributor.authorJu, Yang
dc.date.accessioned2017-05-09T01:06:55Z
dc.date.available2017-05-09T01:06:55Z
dc.date.issued2014
dc.identifier.issn1528-9044
dc.identifier.otherep_136_04_044501.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/154509
dc.description.abstractThroughhole anodic aluminum oxide (AAO) was fabricated by two steps anodization method. The pore diameter of the AAO was 40 nm. Cu nanowire array was prepared using the fabricated AAO as a template by electrochemical deposition. The mechanical and electrical performances of Cu nanowire surface fastener (NSF) were realized by the interconnection of Cu nanowire arrays. The shear and normal bonding strengths for the Cu NSF with 40 nm diameter nanowires were 3.38 أ— 10−3 and 2.46 أ— 10−3 N/cm2, respectively, and the parasitic resistance of it was approximately 22.5 خ©â€‰آ·â€‰cm2.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleFabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener
dc.typeJournal Paper
dc.journal.volume136
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4028316
dc.journal.fristpage44501
dc.journal.lastpage44501
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004
dc.contenttypeFulltext


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