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dc.contributor.authorSalih Erden, Hamza
dc.contributor.authorEzzat Khalifa, H.
dc.contributor.authorSchmidt, Roger R.
dc.date.accessioned2017-05-09T01:06:49Z
dc.date.available2017-05-09T01:06:49Z
dc.date.issued2014
dc.identifier.issn1528-9044
dc.identifier.otherep_136_03_031005.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/154476
dc.description.abstractComputer servers can be represented by lumped thermal capacitances for the purpose of simulating server and data center transient thermal response to changes in operating conditions or equipment failures. Two parameters are needed to characterize the transient behavior of a lumpedcapacitance server: its thermal capacitance and its thermal conductance, heat transfer effectiveness, or time constant. To avoid the laborious task of obtaining these parameters from measurements or estimations of the thermal characteristics of internal components of the server, a method is proposed to derive these parameters from external measurements that can be easily obtained without performing an “autopsyâ€‌ on the server. In this paper, we present the mathematical formulation underlying the proposed method and describe how the parameters are to be obtained from external airtemperature measurements using the mathematical model. We then present validation test cases using experimental data from server shutdown and inlettemperature ramp tests. The experimentally obtained parameters are implemented into a computational fluid dynamics (CFD) case study of server shutdown in which the transient server exit air temperature is computed from the lumpedcapacitance parameters via a userdefined function. The results thus obtained are in excellent agreement with the experimental data.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDetermination of the Lumped Capacitance Parameters of Air Cooled Servers Through Air Temperature Measurements
dc.typeJournal Paper
dc.journal.volume136
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4027092
dc.journal.fristpage31005
dc.journal.lastpage31005
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003
dc.contenttypeFulltext


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