| dc.contributor.author | Mahan, Kenny | |
| dc.contributor.author | Sun, Yong | |
| dc.contributor.author | Han, Bongtae | |
| dc.contributor.author | Han, Sungwon | |
| dc.contributor.author | Osterman, Mike | |
| dc.date.accessioned | 2017-05-09T01:06:49Z | |
| dc.date.available | 2017-05-09T01:06:49Z | |
| dc.date.issued | 2014 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | ep_136_03_031004.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/154475 | |
| dc.description.abstract | Reliability of conformal coatings used to mitigate tin whisker growth depends on their ability to contain tin whiskers. Two key material properties required to assess the reliability of a polyurethane coating are documented experimentally: adhesion strength and puncture strength. A modified blister test using a predefined blister area is employed to assess the adhesion strength and a puncture test is employed to evaluate the puncture strength of the coating. After measuring the properties at time zero, the coatings are subjected to accelerated testing conditions (high temperature/humidity storage and temperature cycling) and the degradations of the coating properties are documented. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth | |
| dc.type | Journal Paper | |
| dc.journal.volume | 136 | |
| dc.journal.issue | 3 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4026922 | |
| dc.journal.fristpage | 31004 | |
| dc.journal.lastpage | 31004 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.tree | Journal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003 | |
| dc.contenttype | Fulltext | |
