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dc.contributor.authorThomas, Dhanesh
dc.contributor.authorSebastian, Mailadil T.
dc.date.accessioned2017-05-09T01:06:49Z
dc.date.available2017-05-09T01:06:49Z
dc.date.issued2014
dc.identifier.issn1528-9044
dc.identifier.otherep_136_03_031002.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/154473
dc.description.abstractPolymer–ceramic composites have been prepared by dispersing Ca4La6(SiO4)4(PO4)2O2 (CLSP) ceramic filler in high density polyethylene (HDPE) matrix through melt mixing. Scanning electron micrographs reveal the extent of filler dispersion. The dielectric properties at 1 MHz and 5 GHz have been investigated as a function of filler content. The relative permittivity increases with filler loading, maintaining a low dielectric loss. The composite with highest filler loading of 0.4 volume fraction shows a relative permittivity of 5.1 and dielectric loss of 2.3 أ— 10−3 at 5 GHz. Experimentally observed values of relative permittivity at 5 GHz have been compared with the values calculated using various theoretical models. Both the coefficient of linear thermal expansion and tensile strength have been observed to decrease with filler loading, reaching a minimum value of 117 ppm/ آ°C and 20.7 MPa, respectively, at 0.4 volume fraction of filler. The composite with maximum filler loading of 0.4 volume fraction shows the highest thermal conductivity (TC) and is 1.2 W m−1 K−1.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleHDPE Matrix Composites Filled With Ca4La6(SiO4)4(PO4)2O2 for Microwave Substrate Applications
dc.typeJournal Paper
dc.journal.volume136
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4027089
dc.journal.fristpage31002
dc.journal.lastpage31002
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003
dc.contenttypeFulltext


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