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dc.contributor.authorZhang, Di
dc.contributor.authorZheng, Lu
dc.contributor.authorXie, Gongnan
dc.contributor.authorXie, Yonghui
dc.date.accessioned2017-05-09T01:06:48Z
dc.date.available2017-05-09T01:06:48Z
dc.date.issued2014
dc.identifier.issn1528-9044
dc.identifier.otherep_136_02_021005.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/154463
dc.description.abstractDimple and protrusion play important roles in the heat transfer enhancement and flow characteristic in cooling channels, which widely employed within electronic cooling systems. NonNewtonian fluid has significant differences with Newtonian fluid, such as water, in fluid characteristic. In this study, an experiment on the viscosity of three different kinds of nonNewtonian fluids, i.e., xanthan gum solution, Carbopol 934 solution, polyacrylamide solution, was first accomplished to acquire the viscosity with different mass fractions. Then, experimental measurements on heat transfer and friction characteristics of nonNewtonian fluid in a rectangular channel with dimples and protrusions were conducted. The overall Nusselt numbers (Nu) and Fanning friction factors at different dimple/protrusion structures were obtained with various inlet flow rates and mass fractions. The results show that only xanthan gum solution has the significant shear thinning effect within the concentration range of this study, and the dimples/protrusions both have great effect on the heat transfer enhancement in the rectangular channel, and that the heat transfer of the case with the protrusions and crossing arrangement can be further enhanced with the higher Nu when compared to the case with the dimples and aligned arrangement. Moreover, an increase in Nu with the higher nonNewtonian fluid mass fraction is observed.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleAn Experimental Study on Heat Transfer Enhancement of Non Newtonian Fluid in a Rectangular Channel With Dimples/Protrusions
dc.typeJournal Paper
dc.journal.volume136
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4025713
dc.journal.fristpage21005
dc.journal.lastpage21005
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 002
dc.contenttypeFulltext


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