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dc.contributor.authorStafford, Jason
dc.contributor.authorFortune, Florian
dc.date.accessioned2017-05-09T01:06:45Z
dc.date.available2017-05-09T01:06:45Z
dc.date.issued2014
dc.identifier.issn1528-9044
dc.identifier.otherep_136_01_011008.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/154449
dc.description.abstractThis paper investigates the thermal and fluid dynamic characteristics due to multiple miniature axial fans with blade chord and span length scales less than 10 mm, impinging air onto finned surfaces. A coupled approach, utilizing both experimental and numerical techniques, has been devised to examine in detail the exit air flow interaction between cooling fans within an array. The findings demonstrate that fans positioned adjacently in an array can influence heat transfer performance both positively and negatively by up to 35% compared to an equivalent single fan—heat sink unit operating standalone. Numerical simulations have provided an insight into the flow fields generated by adjacent fans and also the air flow interaction with fixed fan motor support structures downstream. A novel experimental approach utilizing infrared thermography has been developed to locally assess the validity of the numerical models. In particular, an assessment on implementing compact lumped parameter fans and fans modeled with full geometric detail is shown for two configurations that are impinging air onto finned and flat surfaces. Overall, the study provides an insight into fan cooled heat sinks incorporating multiple miniature axial fans and general recommendations for improving current numerical modeling approaches.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleInvestigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches
dc.typeJournal Paper
dc.journal.volume136
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4026351
dc.journal.fristpage11008
dc.journal.lastpage11008
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 001
dc.contenttypeFulltext


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