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dc.contributor.authorNatarajan, Shweta
dc.contributor.authorHabtemichael, Yishak
dc.contributor.authorGraham, Samuel
dc.date.accessioned2017-05-09T01:00:00Z
dc.date.available2017-05-09T01:00:00Z
dc.date.issued2013
dc.identifier.issn0022-1481
dc.identifier.otherht_135_09_091201.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/152210
dc.description.abstractMethods used to measure the temperature of AlxGa1−xN based ultraviolet light emitting diodes (UV LEDs) are based on optical or electrical phenomena that are sensitive to either local, surface, or average temperatures within the LED. A comparative study of the temperature rise of AlxGa1−xN UV LEDs measured by microRaman spectroscopy, infrared (IR) thermography, and the forward voltage method is presented. Experimental temperature measurements are provided for UV LEDs with micropixel and interdigitated contact geometries, as well as for a number of different packaging configurations. It was found that IR spectroscopy was sensitive to optical properties of the device layers, while forward voltage method provided higher temperatures, in general. Raman spectroscopy was used to measure specific layers within the LED, showing that growth substrate temperatures in the flipchip LEDs agreed more closely to IR measurements while layers closer to the multiple quantum wells (MQWs) agreed more closely with Forward Voltage measurements.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleA Comparative Study of Thermal Metrology Techniques for Ultraviolet Light Emitting Diodes
dc.typeJournal Paper
dc.journal.volume135
dc.journal.issue9
dc.journal.titleJournal of Heat Transfer
dc.identifier.doi10.1115/1.4024359
dc.journal.fristpage91201
dc.journal.lastpage91201
dc.identifier.eissn1528-8943
dc.treeJournal of Heat Transfer:;2013:;volume( 135 ):;issue: 009
dc.contenttypeFulltext


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