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dc.contributor.authorWang, Fuliang
dc.contributor.authorTang, Weidong
dc.contributor.authorLi, Junhui
dc.contributor.authorHan, Lei
dc.date.accessioned2017-05-09T00:57:45Z
dc.date.available2017-05-09T00:57:45Z
dc.date.issued2013
dc.identifier.issn1528-9044
dc.identifier.otherep_135_04_041004.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/151443
dc.description.abstractKinks have a strong influence on the structural performance of wire bonds. In this study, a variablelength linkspring model has been developed to better understand kink formation. In this model, a gold wire was decomposed into segments that were represented by a link and a torsional spring. One end of the gold wire was fixed, and the other end was free. The friction and air tension forces at the wire ends were considered a function of the capillary position, and the wire segments and moment balance equations were added at the free end as the wire length increased. By using this model, the wire profile, moment, and curvature diagrams at the reverse motion stage were obtained to study the dynamical kink formation and wirelength increasing processes. The analysis result was verified experimentally. Good agreement is obtained between the analytical and the experimental wire profiles. This study indicates that a moment magnitude of several hundred mNآ·خ¼m is required to form a kink, and the wire profile is the result of the residual curvature and the instantaneous bending moment.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleVariable Length Link Spring Model for Kink Formation During Wire Bonding
dc.typeJournal Paper
dc.journal.volume135
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4025308
dc.journal.fristpage41004
dc.journal.lastpage41004
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 004
dc.contenttypeFulltext


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