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dc.date.accessioned2017-05-09T00:57:41Z
dc.date.available2017-05-09T00:57:41Z
dc.date.issued2013
dc.identifier.issn1528-9044
dc.identifier.otherep_135_03_030301.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/151421
dc.description.abstractAs the digital factories of the information technology (IT) age, data centers are showing an unprecedented growth. From 2012 to 2016 alone, the global data center traffic is expected to increase four fold [1,21,2], requiring new facilities to be built at the compound annual growth rate of 15.78% during the same period, with the associated positive economic impact. These beneficial outcomes are tempered by concerns about sustainability of such explosive growth, in particular, the energy and water usage burden of the new facilities. Larger facilities can consume tens of megawatts of electric power, with 20–50% of it used for cooling. As such, energy efficient thermal management of current and future facilities has emerged as a significant research challenge and is the focus of this Special Section.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleIntroduction for Journal of Electronic Packaging Special Section on Data Centers
dc.typeJournal Paper
dc.journal.volume135
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4024993
dc.journal.fristpage30301
dc.journal.lastpage30301
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 003
dc.contenttypeFulltext


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