A Novel Low Cost Package for Radio Frequency Applications

dc.contributor.author	Chaturvedi, Sandeep
dc.contributor.author	Koul, Shiban K.
dc.date.accessioned	2017-05-09T00:57:41Z
dc.date.available	2017-05-09T00:57:41Z
dc.date.issued	2013
dc.identifier.issn	1528-9044
dc.identifier.other	ep_135_2_024501.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/151420
dc.description.abstract	Design, fabrication, and test results of a novel 3layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6â€‰GHz.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	A Novel Low Cost Package for Radio Frequency Applications
dc.type	Journal Paper
dc.journal.volume	135
dc.journal.issue	2
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.4023041
dc.journal.fristpage	24501
dc.journal.lastpage	24501
dc.identifier.eissn	1043-7398
dc.tree	Journal of Electronic Packaging:;2013:;volume( 135 ):;issue: 002
dc.contenttype	Fulltext