Show simple item record

dc.contributor.authorLe, Taoran
dc.contributor.authorLin, Ziyin
dc.contributor.authorVyas, Rushi
dc.contributor.authorLakafosis, Vasileios
dc.contributor.authorYang, Li
dc.contributor.authorTraille, Anya
dc.contributor.authorTentzeris, Manos M.
dc.contributor.authorWong, Ching
dc.date.accessioned2017-05-09T00:57:38Z
dc.date.available2017-05-09T00:57:38Z
dc.date.issued2013
dc.identifier.issn1528-9044
dc.identifier.otherep_135_1_011007.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/151404
dc.description.abstractWe discuss here the use of inkjet printing technology as an attractive alternative for the fabrication of radio frequency (RF) electronics. Inkjet printing is compared to widelyused traditional methods such as wet etching and mechanical milling with discussion of the advantages and potential disadvantages afforded by the technology. Next the paper presents the current state of the art for RF printed electronics, including fundamental fabrication technologies, methodologies, and materials. Included are detailed discussions of the fabrication of foundational conductive elements, integration of external elements via low temperature bonding techniques, and enhancement strategies focusing on the addition of novel materials. We then present some current challenges related to inkjet printing, along with some exciting recent advances in materials technology seeking to overcome the current limitations and to expand the frontier of the technology. Following are multiple examples detailing the successful use of inkjet printing methods in the creation of novel RF devices, providing proof of concept and illustrating in greater detail the concepts presented in the theoretical sections.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleInkjet Printing of Radio Frequency Electronics: Design Methodologies and Application of Novel Nanotechnologies
dc.typeJournal Paper
dc.journal.volume135
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4023671
dc.journal.fristpage11007
dc.journal.lastpage11007
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 001
dc.contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record