Show simple item record

dc.contributor.authorHoffman, Jessica
dc.contributor.authorHwang, Seyeon
dc.contributor.authorOrtega, Ada
dc.contributor.authorKim, Nam
dc.contributor.authorMoon, Kyoung
dc.date.accessioned2017-05-09T00:57:37Z
dc.date.available2017-05-09T00:57:37Z
dc.date.issued2013
dc.identifier.issn1528-9044
dc.identifier.otherep_135_1_011006.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/151403
dc.description.abstractDirectwriting systems will be leading the future of additive manufacturing in that they have simple and costeffective processes. There are various types of directwriting systems, such as the rolltoroll (R2R), microdispensing deposition write (MDDW), maskless mesoscale materials deposition (M3D), and inkjet systems. These technologies are being used for the production of radio frequency identification tags (RFIDs), organic lightemitting diodes (OLEDs), lightemitting diodes (LEDs), flexible electronics, solar cells, antennas, etc. Recently, the standardization of printing materials and equipment has become a key issue in the printed electronics industry. The standardization of printed electronics can be categorized into four parts: equipment, materials, testing methods, and the education of this technology.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleThe Standardization of Printable Materials and Direct Writing Systems
dc.typeJournal Paper
dc.journal.volume135
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4023809
dc.journal.fristpage11006
dc.journal.lastpage11006
dc.identifier.eissn1043-7398
dc.treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 001
dc.contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record