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dc.contributor.authorH. Sam Huang
dc.contributor.authorVikas Varshney
dc.contributor.authorJennifer L. Wohlwend
dc.contributor.authorAjit K. Roy
dc.date.accessioned2017-05-09T00:53:40Z
dc.date.available2017-05-09T00:53:40Z
dc.date.copyright41122
dc.date.issued2012
dc.identifier.issn1949-2944
dc.identifier.otherJNEMAA-926528#nano_3_3_031008.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/149963
dc.description.abstractIn this paper, we studied the effect of microscopic surface roughness on heat transfer between aluminum and water by molecular dynamic (MD) simulations and macroscopic surface roughness on heat transfer between aluminum and water by finite element (FE) method. It was observed that as the microscopic scale surface roughness increases, the thermal boundary conductance increases. At the macroscopic scale, different degrees of surface roughness were studied by finite element method. The heat transfer was observed to enhance as the surface roughness increases. Based on the studies of thermal boundary conductance as a function of system size at the molecular level, a procedure was proposed to obtain the thermal boundary conductance at the mesoscopic scale. The thermal boundary resistance at the microscopic scale obtained by MD simulations and the thermal boundary resistance at the mesoscopic scale obtained by the extrapolation procedure can be included and implemented at the interfacial elements in the finite element method at the macroscopic scale. This provides us a useful model, in which different scales of surface roughness can be included, for heat transfer analysis.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleHeat Transfer at Aluminum–Water Interfaces: Effect of Surface Roughness
dc.typeJournal Paper
dc.journal.volume3
dc.journal.issue3
dc.journal.titleJournal of Nanotechnology in Engineering and Medicine
dc.identifier.doi10.1115/1.4007584
dc.journal.fristpage31008
dc.identifier.eissn1949-2952
dc.keywordsHeat transfer
dc.keywordsAluminum
dc.keywordsSurface roughness
dc.keywordsElectrical conductance
dc.keywordsWater
dc.keywordsInterfacial thermal resistance
dc.keywordsEngineering simulation
dc.keywordsMolecular dynamics simulation
dc.keywordsThermal conductivity AND Finite element methods
dc.treeJournal of Nanotechnology in Engineering and Medicine:;2012:;volume( 003 ):;issue: 003
dc.contenttypeFulltext


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