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dc.contributor.authorAlankar Alankar
dc.contributor.authorIoannis N. Mastorakos
dc.contributor.authorHussein M. Zbib
dc.contributor.authorDavid P. Field
dc.date.accessioned2017-05-09T00:50:52Z
dc.date.available2017-05-09T00:50:52Z
dc.date.copyrightApril, 2012
dc.date.issued2012
dc.identifier.issn0094-4289
dc.identifier.otherJEMTA8-27153#021018_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/149004
dc.description.abstractIn latent interactions of dislocations, junction formation is one of the most important phenomena that contribute to the evolution of strength. In this work, the latent hardening coefficients for pure aluminum are estimated using 3D multiscale dislocation dynamics program (MDDP). Three well-known junction configurations, namely, the Hirth lock, the glissile junction, and the Lomer lock, are studied using 3D discrete dislocation dynamics simulations. The evolution of strength is discussed as a function of the resolved shear stress (RSS) and the number of junctions for the three junctions investigated. Hirth lock and Lomer lock are found to be the weakest and strongest junctions, respectively. Collinear reaction of dislocations does not form a junction but causes a higher strength than a Lomer lock. Quantitative and qualitative results are compared with those found in the literature.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleDetermination of Dislocation Interaction Strengths Using Discrete Dislocation Dynamics of Curved Dislocations
dc.typeJournal Paper
dc.journal.volume134
dc.journal.issue2
dc.journal.titleJournal of Engineering Materials and Technology
dc.identifier.doi10.1115/1.4005917
dc.journal.fristpage21018
dc.identifier.eissn1528-8889
dc.keywordsDynamics (Mechanics)
dc.keywordsLocks (Waterways)
dc.keywordsEngineering simulation
dc.keywordsDislocation interactions
dc.keywordsDislocations
dc.keywordsJunctions
dc.keywordsStress
dc.keywordsHardening
dc.keywordsAluminum
dc.keywordsSimulation AND Shear (Mechanics)
dc.treeJournal of Engineering Materials and Technology:;2012:;volume( 134 ):;issue: 002
dc.contenttypeFulltext


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