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dc.contributor.authorQifei Jian
dc.contributor.authorQiaoli Wang
dc.contributor.authorHaoting Wang
dc.contributor.authorZheng Zuo
dc.date.accessioned2017-05-09T00:49:33Z
dc.date.available2017-05-09T00:49:33Z
dc.date.copyrightMarch, 2012
dc.date.issued2012
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26323#011006_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/148607
dc.description.abstractThis paper studies the flow and temperature patterns in an overhead diffuser based data center. In-situ measurements of the data center were carried out to validate a mathematic model for predicting the effect of different air distribution systems. With the measured data of temperatures and airflow velocities, the mathematic model is constructed using a commercial Computational Fluid Dynamics (CFD) software and experimental data to present a comparison between test results and numerical simulations. The area of the data center is 311 square meters and the heat load of the equipment is 320~360 watt per square meter. In-situ temperatures and humidity of the data center were measured with an Automatic Temperature and Humidity measuring instrument, whose error is ±0.5 °C. The discrepancy of the temperature and velocity between the numerical and experimental results were within ±2.3 °C and ±1.8 m/s, respectively. In addition, analysis shows that changing the volume flow rate of the cold air delivered to some diffusers can optimize the temperature field and thereby save the energy.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleComparison Between Numerical and Experimental Results of Airflow Distribution in Diffuser Based Data Center
dc.typeJournal Paper
dc.journal.volume134
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4005912
dc.journal.fristpage11006
dc.identifier.eissn1043-7398
dc.keywordsTemperature
dc.keywordsAir flow
dc.keywordsDiffusers
dc.keywordsData centers
dc.keywordsComputational fluid dynamics AND Computer simulation
dc.treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 001
dc.contenttypeFulltext


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