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dc.contributor.authorR. A. Wirtz
dc.contributor.authorK. Swanson
dc.contributor.authorM. Yaquinto
dc.date.accessioned2017-05-09T00:49:33Z
dc.date.available2017-05-09T00:49:33Z
dc.date.copyrightMarch, 2012
dc.date.issued2012
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26323#011002_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/148603
dc.description.abstractAn important design objective that is unique to hand-held units is the need to constrain two temperatures: the maximum temperature of the electronic components and the maximum skin temperature of the hand-held unit. The present work identifies and evaluates, through parametric modeling and experiments, the passive thermal energy storage volume characteristics and phase change material composite properties that are most suitable for thermal control of small form-factor, high power-density, hand-held electronics. A one-dimensional transient analytical model, based on an integral heat balance, is formulated and benchmarked. The model accurately simulates the heat storage/recovery process in a semi-infinite, “dry” phase change material slab. Dimensional analysis identifies the time and temperature metrics and nondimensional parameters that describe the heat storage/release process. Parametric analysis illustrates how changes in these nondimensional parameters affect thermal energy storage volume thermal response.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleThermal Energy Storage Thermal Response Model With Application to Thermal Management of High Power-Density Hand-Held Electronics
dc.typeJournal Paper
dc.journal.volume134
dc.journal.issue1
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4005915
dc.journal.fristpage11002
dc.identifier.eissn1043-7398
dc.keywordsDensity
dc.keywordsHeat
dc.keywordsTemperature
dc.keywordsPhase transitions
dc.keywordsSkin
dc.keywordsThermal energy storage
dc.keywordsElectronics
dc.keywordsThermal management
dc.keywordsCooling
dc.keywordsHeating AND Design
dc.treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 001
dc.contenttypeFulltext


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