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dc.contributor.authorDustin W. Demetriou
dc.contributor.authorH. Ezzat Khalifa
dc.date.accessioned2017-05-09T00:49:27Z
dc.date.available2017-05-09T00:49:27Z
dc.date.copyrightJune, 2012
dc.date.issued2012
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26326#020904_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/148587
dc.description.abstractThe work presented in this paper describes a simplified thermodynamic model that can be used for exploring optimization possibilities in air-cooled data centers. The model is used to evaluate parametrically the total energy consumption of the data center cooling infrastructure for data centers that utilize aisle containment. The analysis highlights the importance of reducing the total power required for moving the air within the computer room air conditioners (CRACs), the plenum, and the servers, rather than focusing primarily or exclusively on reducing the refrigeration system’s power consumption. In addition, the benefits of introducing a bypass recirculation branch in enclosed aisle configurations are shown. The analysis shows a potential for as much as a 60% savings in cooling infrastructure energy consumption by utilizing an optimized enclosed aisle configuration with bypass recirculation, instead of a traditional enclosed aisle in which all the data center exhaust is forced to flow through the CRACs. Furthermore, computational fluid dynamics is used to evaluate practical arrangements for implementing bypass recirculation in raised floor data centers. A configuration where bypass tiles, with controllable low-lift fans, are placed close to the discharge of CRACs results in increased mixing and is shown to be a suitable method for providing nearly thermally uniform conditions to the inlet of the servers in an enclosed cold aisle. Other configurations of bypass implementation are also discussed and explored.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleOptimization of Enclosed Aisle Data Centers Using Bypass Recirculation
dc.typeJournal Paper
dc.journal.volume134
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4005907
dc.journal.fristpage20904
dc.identifier.eissn1043-7398
dc.keywordsFlow (Dynamics)
dc.keywordsTemperature
dc.keywordsCooling
dc.keywordsComputational fluid dynamics
dc.keywordsOptimization
dc.keywordsData centers
dc.keywordsEnergy consumption
dc.keywordsTiles
dc.keywordsRefrigeration
dc.keywordsFans AND Bifurcation
dc.treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 002
dc.contenttypeFulltext


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