Show simple item record

dc.contributor.authorSarah Kim
dc.contributor.authorYoon Jo Kim
dc.contributor.authorYogendra K. Joshi
dc.contributor.authorPaul A. Kohl
dc.contributor.authorAndrei G. Fedorov
dc.date.accessioned2017-05-09T00:49:25Z
dc.date.available2017-05-09T00:49:25Z
dc.date.copyrightSeptember, 2012
dc.date.issued2012
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-926029#031009_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/148580
dc.description.abstractThe ionic liquid butylmethylimidazolium hexafluorophosphate (bmim)(PF6 ) and five different hydrofluorocarbon refrigerants were investigated as the working fluid pairs for a waste-heat driven absorption heat pump system for possible applications in electronics thermal management. A significant amount of the energy consumed in large electronic systems is used for cooling, resulting in low grade waste heat, which can be used to drive an absorption refrigeration system if a suitable working fluids can be identified. The Redlich–Kwong-type equation of state was used to model the thermodynamic conditions and the binary mixture properties at the corresponding states. The effects of desorber and absorber temperatures, waste-heat quality, and system design on the heat pump performance were investigated. Supporting experiments using R134a/(bmim)(PF6 ) as the working fluid pair were performed. Desorber and absorber outlet temperatures were varied by adjusting the desorber supply power and the coolant temperature at the evaporator inlet, respectively. For an evaporator temperature of 41 °C, which is relevant to electronics cooling applications, the maximum cooling-to-total-energy input was 0.35 with the evaporator cooling capability of 36 W and the desorber outlet temperature in the range of 50 to 110 °C.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleAbsorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
dc.typeJournal Paper
dc.journal.volume134
dc.journal.issue3
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4007111
dc.journal.fristpage31009
dc.identifier.eissn1043-7398
dc.keywordsTemperature
dc.keywordsFluids
dc.keywordsAbsorption
dc.keywordsRefrigeration
dc.keywordsHeat pumps
dc.keywordsRefrigerants
dc.keywordsCooling
dc.keywordsMixtures
dc.keywordsWaste heat
dc.keywordsHeat AND Pressure
dc.treeJournal of Electronic Packaging:;2012:;volume( 134 ):;issue: 003
dc.contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record