Pull Force and Displacement of Cu/Au Wire Interconnects

dc.contributor.author	J. Lau
dc.contributor.author	S. Wu
dc.contributor.author	J. M. Lau
dc.date.accessioned	2017-05-09T00:49:21Z
dc.date.available	2017-05-09T00:49:21Z
dc.date.copyright	41244
dc.date.issued	2012
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-926513#ep_134_4_041002.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/148561
dc.description.abstract	The pull force and displacement of gold (Au) and copper (Cu) wires in microelectronics are investigated in this study. Emphasis is placed on (1) the development of a set of equations for determining the internal forces and deformations of wires when subjected to an external pull force, (2) the determination of the maximum pull force (when the wire breaks) based on some failure criteria of the wires, and (3) the experimental verification of the present equations.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Pull Force and Displacement of Cu/Au Wire Interconnects
dc.type	Journal Paper
dc.journal.volume	134
dc.journal.issue	4
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.4007233
dc.journal.fristpage	41002
dc.identifier.eissn	1043-7398
dc.keywords	Force
dc.keywords	Wire AND Displacement
dc.tree	Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 004
dc.contenttype	Fulltext