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dc.contributor.authorD. Pinisetty
dc.contributor.authorN. Haldolaarachchige
dc.contributor.authorR. V. Devireddy
dc.contributor.authorD. P. Young
dc.date.accessioned2017-05-09T00:46:23Z
dc.date.available2017-05-09T00:46:23Z
dc.date.copyrightFebruary, 2011
dc.date.issued2011
dc.identifier.issn1949-2944
dc.identifier.otherJNEMAA-28051#011006_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/147333
dc.description.abstractAn experimental setup has been designed and built for measuring the Seebeck coefficient of bulk thermoelectric materials, thin films, and nanowire composites in the temperature range 200–350 K. The setup utilizes a differential method for measuring the Seebeck coefficient of the sample. The sample holder is a simple clamp design, utilizing a spring-loaded mounting system to load and hold the sample between two copper blocks, on which the electrical leads, as well as thermocouples, are mounted. The spring-loaded design also offers fast turn-around times, as the samples can be quickly loaded and unloaded. To measure the Seebeck coefficient, a temperature difference is generated across the sample by using four 10 kΩ resistive heaters mounted in series on one of the copper blocks. The resulting slope of the thermo-emf versus temperature difference plot is used to obtain the Seebeck coefficient at any temperature. Test measurements were carried out on bulk samples of nickel (Ni), bismuth-telluride (Bi2Te3), antimony-telluride (Sb2Te3), as well as thin films and nanowire composites of Ni.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleA Novel Experimental Device for Seebeck Coefficient Measurements of Bulk Materials, Thin Films, and Nanowire Composites
dc.typeJournal Paper
dc.journal.volume2
dc.journal.issue1
dc.journal.titleJournal of Nanotechnology in Engineering and Medicine
dc.identifier.doi10.1115/1.4003192
dc.journal.fristpage11006
dc.identifier.eissn1949-2952
dc.keywordsNickel
dc.keywordsComposite materials
dc.keywordsBulk solids
dc.keywordsThin films
dc.keywordsTemperature
dc.keywordsNanowires
dc.keywordsCopper
dc.keywordsThermocouples
dc.keywordsDesign AND Springs
dc.treeJournal of Nanotechnology in Engineering and Medicine:;2011:;volume( 002 ):;issue: 001
dc.contenttypeFulltext


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