Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09

dc.contributor.author	Marta Rencz
dc.date.accessioned	2017-05-09T00:43:13Z
dc.date.available	2017-05-09T00:43:13Z
dc.date.copyright	March, 2011
dc.date.issued	2011
dc.identifier.issn	1528-9044
dc.identifier.other	JEPAE4-26312#010301_1.pdf
dc.identifier.uri	http://yetl.yabesh.ir/yetl/handle/yetl/145815
dc.description.abstract	Microelectronics thermal experts from four continents met in the fall of 2009 at the 15th THERMINIC Workshop in Leuven, Belgium. The event was sponsored by the IEEE Computer Society Test Technology Technical Council and the CMP Laboratory, in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society, and the European Test Technology Technical Committee. The Workshop had participants from 25 countries.
dc.publisher	The American Society of Mechanical Engineers (ASME)
dc.title	Thermal Investigations of Integrated Circuits and Systems, THERMINIC'09
dc.type	Journal Paper
dc.journal.volume	133
dc.journal.issue	1
dc.journal.title	Journal of Electronic Packaging
dc.identifier.doi	10.1115/1.3565444
dc.journal.fristpage	10301
dc.identifier.eissn	1043-7398
dc.keywords	Integrated circuits
dc.tree	Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 001
dc.contenttype	Fulltext