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dc.contributor.authorLin Hu
dc.contributor.authorWilliam Evans
dc.contributor.authorPawel Keblinski
dc.date.accessioned2017-05-09T00:43:12Z
dc.date.available2017-05-09T00:43:12Z
dc.date.copyrightJune, 2011
dc.date.issued2011
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26313#021002_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/145807
dc.description.abstractWe present a concept for development of high thermal conductivity thermal interface materials (TIMs) via a rapid formation of conductive network. In particular we use molecular dynamics simulations to demonstrate the possibility of a formation of a network of solid nanoparticles in liquid solution and establish wetting and volume fraction conditions required for a rapid formation of such network. Then, we use Monte-Carlo simulations to determine effective thermal conductivity of the solid/liquid composite material. The presence of a percolating network dramatically increases the effective thermal conductivity, as compared to values characterizing dispersed particle structures.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleThermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials
dc.typeJournal Paper
dc.journal.volume133
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4003865
dc.journal.fristpage21002
dc.identifier.eissn1043-7398
dc.keywordsParticulate matter
dc.keywordsThermal conductivity
dc.keywordsNetworks
dc.keywordsNanoparticles
dc.keywordsComposite materials
dc.keywordsSelf-assembly
dc.keywordsMolecular dynamics simulation
dc.keywordsWetting (Surface science) AND Engineering simulation
dc.treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
dc.contenttypeFulltext


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