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dc.contributor.authorStephen L. Hodson
dc.contributor.authorThiruvelu Bhuvana
dc.contributor.authorBaratunde A. Cola
dc.contributor.authorXianfan Xu
dc.contributor.authorG. U. Kulkarni
dc.contributor.authorTimothy S. Fisher
dc.date.accessioned2017-05-09T00:43:11Z
dc.date.available2017-05-09T00:43:11Z
dc.date.copyrightJune, 2011
dc.date.issued2011
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26313#020907_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/145803
dc.description.abstractCarbon nanotube (CNT) arrays can be effective thermal interface materials with high compliance and conductance over a wide temperature range. Here, we study CNT interface structures in which free CNT ends are bonded using Pd hexadecanethiolate, Pd(SC16 H35 )2 , to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The Pd weld is particularly attractive for its mechanical stability at high temperatures. A transient photoacoustic (PA) method is used to measure the thermal resistance of the palladium-bonded CNT interfaces. The interfaces were bonded at moderate pressures and then tested at 34 kPa using the PA technique. At an interface temperature of approximately 250°C, one-sided and two-sided palladium-bonded interfaces achieved thermal resistances near 10 mm2 K/W and 5 mm2 K/W, respectively.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titlePalladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces
dc.typeJournal Paper
dc.journal.volume133
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4004094
dc.journal.fristpage20907
dc.identifier.eissn1043-7398
dc.keywordsCarbon nanotubes
dc.keywordsNanoparticles
dc.keywordsPalladium
dc.keywordsBonding AND Temperature
dc.treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
dc.contenttypeFulltext


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