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dc.contributor.authorDrazen Fabris
dc.contributor.authorPatrick Wilhite
dc.contributor.authorCary Y. Yang
dc.contributor.authorToshishige Yamada
dc.contributor.authorMichael Rosshirt
dc.contributor.authorChristopher Cardenas
dc.date.accessioned2017-05-09T00:43:10Z
dc.date.available2017-05-09T00:43:10Z
dc.date.copyrightJune, 2011
dc.date.issued2011
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26313#020902_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/145797
dc.description.abstractImprovements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle fillers and a matrix that allows for good surface wetting and compliance of the material during application. Two types of TIMs are tested based on the addition of carbon nanotubes (CNTs): one mixed with a commercial TIM product and the other only CNTs and silicone oil. The materials are tested using an in-house apparatus that allows for the simultaneous measurement of temperature, pressure, heat flux, and TIM thickness. Results show that addition of large quantities of CNTs degrades the performance of the commercial TIM, while the CNT-silicone oil mixtures showed improved performance at high pressures. Thickness and pressure measurements indicate that the CNT-thermal grease mixtures are more compliant, with a small increase in bulk thermal conductivity over the range of tested pressures.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleApplication of Carbon Nanotubes to Thermal Interface Materials
dc.typeJournal Paper
dc.journal.volume133
dc.journal.issue2
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4003864
dc.journal.fristpage20902
dc.identifier.eissn1043-7398
dc.keywordsPressure
dc.keywordsCarbon nanotubes
dc.keywordsMixtures
dc.keywordsThickness
dc.keywordsThermal conductivity
dc.keywordsThermal resistance AND Arctic region
dc.treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
dc.contenttypeFulltext


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