| dc.contributor.author | Eduardo Nogueira | |
| dc.contributor.author | Manuel Vázquez | |
| dc.contributor.author | Carlos Algora | |
| dc.date.accessioned | 2017-05-09T00:43:10Z | |
| dc.date.available | 2017-05-09T00:43:10Z | |
| dc.date.copyright | September, 2011 | |
| dc.date.issued | 2011 | |
| dc.identifier.issn | 1528-9044 | |
| dc.identifier.other | JEPAE4-26316#034501_1.pdf | |
| dc.identifier.uri | http://yetl.yabesh.ir/yetl/handle/yetl/145795 | |
| dc.description.abstract | In this work, we have evaluated the reliability of epoxy packaged light emitting diodes (LEDs) for outdoor applications by specific tests to enhance catastrophic failures that appear under high temperature and humidity operation conditions. The different failure mechanisms were analyzed observing two main types: one is open circuit catastrophic failures induced by moisture and the other one power luminosity degradation. The influence of temperature and humidity on catastrophic failures was modelled using the Arrhenius–Peck law obtaining an activation energy of 0.87 eV and a Peck parameter of 2.29. MTTF value of 1.582 × 106 h at low bias current, 10 mA, has been evaluated. | |
| dc.publisher | The American Society of Mechanical Engineers (ASME) | |
| dc.title | Accelerated Life Testing in Epoxy Packaged High Luminosity Light Emitting Diodes | |
| dc.type | Journal Paper | |
| dc.journal.volume | 133 | |
| dc.journal.issue | 3 | |
| dc.journal.title | Journal of Electronic Packaging | |
| dc.identifier.doi | 10.1115/1.4004659 | |
| dc.journal.fristpage | 34501 | |
| dc.identifier.eissn | 1043-7398 | |
| dc.keywords | Epoxy adhesives | |
| dc.keywords | Failure | |
| dc.keywords | Light-emitting diodes | |
| dc.keywords | Temperature AND Circuits | |
| dc.tree | Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 003 | |
| dc.contenttype | Fulltext | |
