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dc.contributor.authorG. Lorenzini
dc.contributor.authorC. Biserni
dc.contributor.authorL. A. Isoldi
dc.contributor.authorL. A. O. Rocha
dc.contributor.authorE. D. dos Santos
dc.date.accessioned2017-05-09T00:43:06Z
dc.date.available2017-05-09T00:43:06Z
dc.date.copyrightDecember, 2011
dc.date.issued2011
dc.identifier.issn1528-9044
dc.identifier.otherJEPAE4-26319#041008_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/145770
dc.description.abstractIn this paper, we rely on the Constructal method to optimize the geometry of a Y-shaped cavity embedded into a solid conducting wall. The structure has four degrees of freedom. The objective is to minimize the global thermal resistance between the solid and the cavity. The optimization procedure has demonstrated that for larger solids, a cavity shaped as T led to a minimization of the global thermal resistance, while the opposite effect is observed for tall solids, where the optimal shapes are reached when the bifurcated branches deeply penetrates the solid in the vertical direction, according to the Constructal principle of “optimal distribution of imperfections”. The three times minimized global thermal resistance of the Y-shaped cavity has been correlated by power laws as a function of its corresponding optimal configurations. Finally, the performance of the Y-shaped intrusion proved to be superior to that of other basic geometries: the optimized global thermal resistances of the Y-shaped cavities obtained for H/L = 1.0, 2.0, and 5.0 were, respectively 66.61%, 55.37%, and 19.05% lower than the optimal T-shaped cavities under the same thermal and geometric conditions. Furthermore, in comparison with the “finger cavity” shaped as C, the Y-shaped cavities increased the thermal performance in 109.12%, 84.45%, 59.32%, and 20.10% for H/L = 0.5, 1.0, 2.0, and 5.0, respectively.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleConstructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium
dc.typeJournal Paper
dc.journal.volume133
dc.journal.issue4
dc.journal.titleJournal of Electronic Packaging
dc.identifier.doi10.1115/1.4005296
dc.journal.fristpage41008
dc.identifier.eissn1043-7398
dc.keywordsCavities
dc.keywordsGeometry
dc.keywordsShapes
dc.keywordsThermal resistance
dc.keywordsDesign
dc.keywordsOptimization
dc.keywordsDegrees of freedom AND Bifurcation
dc.treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 004
dc.contenttypeFulltext


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