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dc.contributor.authorZ. Ahmad
dc.contributor.authorM. P. Ansell
dc.contributor.authorD. Smedley
dc.date.accessioned2017-05-09T00:37:58Z
dc.date.available2017-05-09T00:37:58Z
dc.date.copyrightJuly, 2010
dc.date.issued2010
dc.identifier.issn0094-4289
dc.identifier.otherJEMTA8-27130#031016_1.pdf
dc.identifier.urihttp://yetl.yabesh.ir/yetl/handle/yetl/143343
dc.description.abstractThe environmental stability of three room temperature cure epoxy adhesives was evaluated following exposure to temperatures of 20°C, 30°C, and 50°C at 95%RH, to 50°C in air and soaked in water for up to 90 days. The adhesives contained nano- and microparticles and were especially formulated for bonded-in timber connections, and the properties of bulk adhesives and adhesively bonded block shear specimens were evaluated. After 90 days of aging the results demonstrate critical temperature effects controlled by the glass transition temperature. The apparent free volume for all the adhesives remains constant as moisture is absorbed but plasticization takes place at high temperature and relative humidity, evidenced by the increased elongation and yield observed by strain values and scanning electron microscope. Exposure at 50°C in air causes the adhesives to postcure enhancing strength but high humidity causes degradation. Nanofiller additions enhance environmental stability but the addition of microparticles provides better moisture resistance.
dc.publisherThe American Society of Mechanical Engineers (ASME)
dc.titleEpoxy Adhesives Modified With Nano- and Microparticles for In Situ Timber Bonding: Effect of Environment on Mechanical Properties and Moisture Uptake
dc.typeJournal Paper
dc.journal.volume132
dc.journal.issue3
dc.journal.titleJournal of Engineering Materials and Technology
dc.identifier.doi10.1115/1.4001836
dc.journal.fristpage31016
dc.identifier.eissn1528-8889
dc.keywordsTemperature
dc.keywordsAdhesives
dc.keywordsTimber
dc.keywordsEpoxy adhesives
dc.keywordsWater
dc.keywordsBonding AND Microparticles
dc.treeJournal of Engineering Materials and Technology:;2010:;volume( 132 ):;issue: 003
dc.contenttypeFulltext


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